Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)
We will manufacture multi-layer flexible substrates (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)
Taiyo Industry supports everything from prototyping to mass production. - Achieves high density through pad-on-bead technology. - Supports 400μm pitch BGA. - Improved design flexibility with high-density multilayer structures. - Also supports impedance management. For more detailed information, please feel free to contact our representative. #Flex #FPC #FlexibleSubstrate #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance
- Company：太洋テクノレックス 本社 和歌山
- Price：Other
